ucirvinetext middletop topright
hemresgroup
fill
fill About Us
fill
fill Research Projects
fill
fill Collaborations
fill
fill Group Members
fill
fill
fill Publications
fill
fill AirUCI
fill
fill Grant Info
fill
fill Fun

Photodeposition of Pt and Au onto TiO2

The titanium dioxide nanoparticles grown at the steps of highly oriented pyrolytic graphite contain round and rod shapes.

titanium dioxide

 

The semiconductor posseses a wide band gap that depends on crystal phase and size. By absorbing ultraviolet at wavelengths with an energy larger than the band gap, photogenerated electrons and holes may trap at the surface and partake in redox reactions.

charge generation

 

Among the myriad of reaction involving titanium dioxide include the reduction and deposition of noble metals such platinum. The selective deposition of platinum onto the titanium dioxide nanoparticles versus randomly on the surface of the sample supports the photoreduction mechanism. This process demonstrates a potential method of incorporating mesoporous titanium dioxide with metal nanoparticles for fundamental studies and applications involving heterogeneous catalysis and photocatalysis.

 

selective deposition

 

 

Platinum, gold, and to a minimal extent silver, nanoparticles were grown separately onto titanium dioxide nanoparticles.

metals on titanium dioxide

 

 

fill
fill

Photodeposition of Ag or Pt onto TiO2 Nanoparticles Decorated on Step Edges of HOPG
J. Taing, M.H. Cheng, J.C. Hemminger
ACS Nano 2011, 5(9), 6325-6333.
10.1021/nn201396v

Narrowing of Band Gap in Thin Films and Linear Arrays of Ordered TiO2 Nanoparticles
Y. Liu, J. Taing, C.-C. Chen, A.P. Sorini, M.H. Cheng, A.M. Margarella, H. Bluhm, Z. Liu, T.P. Devereaux, J.C. Hemminger
In Preperation

Photodeposition of Au at TiO2 Nanoparticles Decorated on Steps of Graphite
J. Taing, A.M. Margarella, Y. Liu, J.C. Hemminger
In Preperation

Electronic Structures of TiO2 Nanoparticles Functionalized with Pt Photodeposition
Y. Liu, J. Taing, C.-C. Chen, A.P. Sorini, M.H. Cheng, A.M. Margarella, H. Bluhm, Z. Liu, T.P. Devereaux, J.C. Hemminger
In Preperation

 

 

 

fill